Manufacturing method of semiconductor devices

Details Manufacturing method of semiconductor devices Manufacturing method of semiconductor devices

2011-04-12

2011-04-12

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S464000, C438S691000, C257SE21602

Reexamination Certificate

active

07923351

ABSTRACT:
In a method of manufacturing semiconductor chips by dicing individual semiconductor devices from a semiconductor wafer, masks formed for plasma dicing in which a semiconductor wafer is divided by conducting plasma etching are removed by mechanical grinding using a grinding head. Accordingly, by removing the masks for plasma dicing using mechanical grinding, generation of reaction products is prevented when removing the masks, so that the dicing can be conducted without causing quality deterioration due to the accumulated particles.

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patent: 6897128 (2005-05-01), Arita
patent: 2008/0153283 (2008-06-01), Abdelrahman et al.
patent: 2004-172364 (2004-06-01), None
patent: 2004/047165 (2004-06-01), None

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