Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-06-07
2011-06-07
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S125000, C438S126000, C438S508000
Reexamination Certificate
active
07955902
ABSTRACT:
A semiconductor device manufacturing method in which a semiconductor chip is connected to first and second lead frames. Source and gate electrodes extending over a first main surface of the semiconductor chip are connected to first electrode plates of the first lead frame and a drain electrode on the second main surface of the semiconductor chip, opposite to the first main surface, is connected to a drain electrode plate of the second lead frame. A sealing body is formed to cover the semiconductor chip and lead frames, while leaving the top surface of the drain electrode plate exposed with respect to the sealing body. Unnecessary portions of the first and second lead frames are cut off and surface mounting terminals are formed from the portions of the first and second electrode plates projecting from the sealing body.
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Hata Toshiyuki
Otani Takeshi
Shimizu Ichio
Le Dung A.
Mattingly & Malur, P.C.
Renesas Electronics Corporation
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