Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-11-10
2010-11-23
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S127000
Reexamination Certificate
active
07838335
ABSTRACT:
The adhesive property of the mold resin exposed to the ball face side of a semiconductor package and under-filling resin is improved, and the manufacturing method of the semiconductor device which can prevent peeling at both interface is obtained. The sputtering step which does sputtering of the ball face side of the semiconductor package whose mold resin in which wax or fatty acid was included exposed to the ball face side by Ar plasma, the step which does flip chip junction of the semiconductor package at wiring substrate upper part after the sputtering step, and the step fills up with under-filling resin between the semiconductor package and the wiring substrate are included.
REFERENCES:
patent: 7459342 (2008-12-01), Hayashi et al.
patent: 11-35800 (1999-02-01), None
patent: 2000-281750 (2000-10-01), None
patent: 2001-85609 (2001-03-01), None
patent: 2001-270977 (2001-10-01), None
Hayashi Eiji
Sugimura Takahiro
Geyer Scott B
Mattingly & Malur, P.C.
Renesas Electronics Corporation
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