Manufacturing method of semiconductor device, semiconductor...

Details Manufacturing method of semiconductor device, semiconductor... Manufacturing method of semiconductor device, semiconductor...

2006-09-19

2006-09-19

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

07109060

ABSTRACT:
A method of manufacturing a semiconductor device is provided. The method includes embedding and forming a coupling terminal as an external electrode of an electronic circuit on an active surface side of a substrate having an active surface formed with a plurality of electronic circuits, exposing a part of the coupling terminal by polishing a back surface side of the substrate, mounting a semiconductor chip on the back surface side of the substrate via the coupling terminal, sealing the semiconductor chip mounted on the substrate by a sealing material, and cutting the substrate for every forming area of each electronic circuit and dividing it into a plurality of semiconductor devices.

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