Manufacturing method of semiconductor device, including...

Details Manufacturing method of semiconductor device, including... Manufacturing method of semiconductor device, including...

2006-12-05

2006-12-05

Toledo, Fernando L. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C174S250000, C174S261000, C257SE21503, C257SE23065, C257SE23070

Reexamination Certificate

active

07144758

ABSTRACT:
First bump electrodes are arrayed in a straight line along a first side of a semiconductor chip. Second bump electrodes are more narrowly arrayed in a zigzag arrangement along a second side of the chip. By carrying out an injection of a sealing resin from the second side on which the second bump electrodes are arrayed, a surface of the semiconductor chip that is subjected to face-down mounting on a film substrate is sealed.

REFERENCES:
patent: 6437253 (2002-08-01), Saito et al.
patent: 6867490 (2005-03-01), Toyosawa
patent: 2000-049193 (2000-02-01), None
patent: 2000-269611 (2000-09-01), None
patent: 3431406 (2003-05-01), None
patent: 2004-221319 (2004-08-01), None
patent: 2004-221320 (2004-08-01), None
Communication from Japanese Patent Office re: related application, no date.

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