Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-05-29
2007-05-29
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S106000, C438S460000, C257SE21599
Reexamination Certificate
active
10961041
ABSTRACT:
In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.
REFERENCES:
patent: 2002/0089052 (2002-07-01), Yamaura et al.
patent: 2005/0026335 (2005-02-01), Omote et al.
patent: 9-116091 (1997-05-01), None
patent: 11-31704 (1999-02-01), None
patent: 2002-208668 (2002-07-01), None
Ida Tsutomu
Kobayashi Yoshihiko
Kudaishi Tomoaki
Nakajima Hirokazu
Niitsu Toshiharu
Lee Cheung
Mattingly, Stanger Malur & Brundidge PC
Renesas Technology Corp.
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