Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

1994-07-19

1995-12-19

Maples, John S.

Fishing, trapping, and vermin destroying

437194, 437195, H01L 21441

Patent

active

054768152

ABSTRACT:
A method of manufacturing a semiconductor device having a bonding pad portion. A wiring is formed on a substrate and an insulative protective film is formed onto the wiring. An opening portion is exposed and serves as the bonding pad portion in which a surface of a part of the wiring is exposed. A metal film is selectively grown only in this opening position.

REFERENCES:
patent: 3761309 (1973-09-01), Schmitter
patent: 5180687 (1993-01-01), Mikoshiba et al.

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