Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2009-03-20

2010-10-26

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S108000, C438S464000, C257SE21514

Reexamination Certificate

active

07820487

ABSTRACT:
A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.

REFERENCES:
patent: 2002/0168797 (2002-11-01), DiStefano et al.
patent: 9-116251 (1997-05-01), None
patent: 11-54554 (1999-02-01), None
patent: 2001-068603 (2001-03-01), None
patent: 2003-234359 (2003-08-01), None
patent: 2005-26311 (2005-01-01), None
patent: 2006-179811 (2006-07-01), None
International Search Report of PCT/JP2006/319142, Mailing Date of Dec. 5, 2006.

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