Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2008-07-14

2010-06-29

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21503, C257SE21508, C257SE21511

Reexamination Certificate

active

07745258

ABSTRACT:
A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.

REFERENCES:
patent: 5784261 (1998-07-01), Pedder
patent: 6504241 (2003-01-01), Yanagida
patent: 6515370 (2003-02-01), Hashimoto
patent: 7122906 (2006-10-01), Doan
patent: 11-340270 (1999-12-01), None
patent: 2001-257310 (2001-09-01), None
patent: 2001-308258 (2001-11-01), None
patent: 2002-110726 (2002-04-01), None
patent: 2003-59958 (2003-02-01), None
patent: 2004-146728 (2004-05-01), None
patent: 2004-356655 (2004-12-01), None
patent: 3963484 (2007-08-01), None
patent: WO 98/40915 (1998-09-01), None
Chin et al. “Breakthrough Ball Attach Technology by introducing Solder Paste Screen Printing.” IEEE 2001 Electronic Components and Technology Conference.

Affiliated with

Also associated with

Rating

Manufacturing method of semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4208289