Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2006-05-22

2010-02-02

Coleman, W. David (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S620000

Reexamination Certificate

active

07655505

ABSTRACT:
A manufacturing method of a semiconductor device, includes i) a step of providing a transparent member above a main surface of a semiconductor substrate where a plurality of semiconductor elements is formed; ii) a first dividing step of dividing the transparent member corresponding to a designated area of the semiconductor element; iii) a second dividing step of dividing the transparent member corresponding to an external configuration of the semiconductor element; and iv) a dividing step of dividing the semiconductor substrate into the semiconductor elements corresponding to a dividing position of the transparent member.

REFERENCES:
patent: 5830807 (1998-11-01), Matsunaga et al.
patent: 2004-172249 (2004-06-01), None
patent: 2004-296738 (2004-10-01), None
patent: 511256 (2002-11-01), None
patent: 544887 (2003-08-01), None
Translation of TW 544887—Aug. 1, 2003.
Taiwanese Office Action dated Nov. 4, 2008 (mailing date), issued in corresponding Taiwanese Reference No. 09720591850.
Taiwanese Office Action dated Mar. 27, 2008 (date of receipt) reference No. 09720156970, issued in corresponding Taiwanese Patent Application No. 095118094 filed May 22, 2006 and English translation.

Affiliated with

Also associated with

Rating

Manufacturing method of semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4205100