Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-07-19
2010-02-16
Pham, Thanhha (Department: 2894)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S465000, C257SE21523
Reexamination Certificate
active
07662670
ABSTRACT:
A glass substrate is bonded through a resin to the top surface of a semiconductor wafer on which a first wiring is formed. A V-shaped groove is formed by notching from the back surface of the wafer. A second wiring connected with the first wiring and extending over the back surface of the wafer is formed. A protection film composed of an organic resin or a photoresist layer to provide protection with an opening is formed on the second wiring by spray coating. A conductive terminal is formed by screen printing using the protection film as a solder mask. A cushioning material may be formed on the back surface of the wafer by spray coating.
REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 3756872 (1973-09-01), Goodman
patent: 3787252 (1974-01-01), Filippazzi et al.
patent: 4954875 (1990-09-01), Clements
patent: 4978639 (1990-12-01), Hua et al.
patent: 5229647 (1993-07-01), Gnadinger
patent: 5350662 (1994-09-01), Chi
patent: 5476819 (1995-12-01), Warren
patent: 5648684 (1997-07-01), Bertin et al.
patent: 5682062 (1997-10-01), Gaul
patent: 5691245 (1997-11-01), Bakhit et al.
patent: 5895234 (1999-04-01), Taniguchi et al.
patent: 5895970 (1999-04-01), Miyoshi et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5910687 (1999-06-01), Chen et al.
patent: 5927993 (1999-07-01), Lesk et al.
patent: 5998866 (1999-12-01), Ochi et al.
patent: 6002163 (1999-12-01), Wojnarowski
patent: 6027958 (2000-02-01), Vu et al.
patent: 6042922 (2000-03-01), Senoo et al.
patent: 6051489 (2000-04-01), Young et al.
patent: 6054760 (2000-04-01), Martinez-Tovar et al.
patent: 6066513 (2000-05-01), Pogge et al.
patent: 6110825 (2000-08-01), Mastromatteo et al.
patent: 6136668 (2000-10-01), Tamaki et al.
patent: 6184060 (2001-02-01), Siniaguine
patent: 6221751 (2001-04-01), Chen et al.
patent: 6259039 (2001-07-01), Chroneos et al.
patent: 6300224 (2001-10-01), Arima et al.
patent: 6316287 (2001-11-01), Zandman et al.
patent: 6326689 (2001-12-01), Thomas
patent: 6339251 (2002-01-01), Ha et al.
patent: 6358772 (2002-03-01), Miyoshi
patent: 6362529 (2002-03-01), Sumikawa et al.
patent: 6399463 (2002-06-01), Glenn et al.
patent: 6406934 (2002-06-01), Glenn et al.
patent: 6420211 (2002-07-01), Brunet et al.
patent: 6424031 (2002-07-01), Glenn
patent: 6432744 (2002-08-01), Amador et al.
patent: 6433418 (2002-08-01), Fujisawa
patent: 6485814 (2002-11-01), Moriizumi et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6552426 (2003-04-01), Ishio
patent: 6597059 (2003-07-01), McCann et al.
patent: 6607941 (2003-08-01), Prabhu et al.
patent: 6611052 (2003-08-01), Poo et al.
patent: 6624505 (2003-09-01), Badehi
patent: 6646289 (2003-11-01), Badehi
patent: 6649931 (2003-11-01), Honma et al.
patent: 6693358 (2004-02-01), Yamada
patent: 6703689 (2004-03-01), Wada
patent: 6720661 (2004-04-01), Hanaoka et al.
patent: 6753936 (2004-06-01), Tanaka
patent: 6780251 (2004-08-01), Tometsuka
patent: 6781244 (2004-08-01), Prabhu
patent: 6805279 (2004-10-01), Lee et al.
patent: 6812573 (2004-11-01), Shimoishizaka
patent: 6828175 (2004-12-01), Wood et al.
patent: 6848177 (2005-02-01), Swan et al.
patent: 6864172 (2005-03-01), Noma et al.
patent: 6894386 (2005-05-01), Poo et al.
patent: 6964915 (2005-11-01), Farnworth et al.
patent: 7045870 (2006-05-01), Wataya
patent: 7064047 (2006-06-01), Fukasawa et al.
patent: 7067354 (2006-06-01), Prabhu
patent: 7101735 (2006-09-01), Noma et al.
patent: 7208340 (2007-04-01), Noma
patent: 7271466 (2007-09-01), Noma et al.
patent: 7312107 (2007-12-01), Noma et al.
patent: 7312521 (2007-12-01), Noma et al.
patent: 7399683 (2008-07-01), Noma et al.
patent: 7456083 (2008-11-01), Noma et al.
patent: 2001/0005043 (2001-06-01), Nakanishi et al.
patent: 2002/0005400 (2002-01-01), Gat
patent: 2002/0016024 (2002-02-01), Thomas
patent: 2002/0022343 (2002-02-01), Nonaka
patent: 2002/0025587 (2002-02-01), Wada
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2002/0047210 (2002-04-01), Yamada
patent: 2002/0048889 (2002-04-01), Hayama et al.
patent: 2002/0076855 (2002-06-01), Pierce
patent: 2002/0089043 (2002-07-01), Park et al.
patent: 2002/0105591 (2002-08-01), Nakamura et al.
patent: 2002/0110953 (2002-08-01), Ahn et al.
patent: 2002/0139577 (2002-10-01), Miller
patent: 2002/0158060 (2002-10-01), Uchiyama et al.
patent: 2002/0185725 (2002-12-01), Moden et al.
patent: 2003/0077878 (2003-04-01), Kumar et al.
patent: 2003/0094683 (2003-05-01), Poo et al.
patent: 2003/0134453 (2003-07-01), Prabhu et al.
patent: 2003/0216009 (2003-11-01), Matsuura et al.
patent: 2003/0230805 (2003-12-01), Noma et al.
patent: 2004/0017012 (2004-01-01), Yamada et al.
patent: 2004/0041260 (2004-03-01), Wood et al.
patent: 2004/0137701 (2004-07-01), Takao
patent: 2004/0142509 (2004-07-01), Imai
patent: 2004/0161920 (2004-08-01), Noma et al.
patent: 2004/0229405 (2004-11-01), Prabhu
patent: 2004/0235270 (2004-11-01), Noma et al.
patent: 2005/0095750 (2005-05-01), Lo et al.
patent: 2005/0208735 (2005-09-01), Noma et al.
patent: 2005/0221585 (2005-10-01), Perregaux et al.
patent: 2005/0266660 (2005-12-01), Behammer
patent: 2006/0068572 (2006-03-01), Noma et al.
patent: 2006/0079019 (2006-04-01), Kim
patent: 2006/0270093 (2006-11-01), Noma et al.
patent: 2007/0026639 (2007-02-01), Noma et al.
patent: 2007/0117352 (2007-05-01), Lee et al.
patent: 2007/0138498 (2007-06-01), Zilber et al.
patent: 2007/0166957 (2007-07-01), Kameyama et al.
patent: 2008/0093708 (2008-04-01), Noma et al.
patent: 2008/0265424 (2008-10-01), Noma et al.
patent: 2009/0023249 (2009-01-01), Honer et al.
patent: 19846232 (2000-03-01), None
patent: 10238444 (2004-03-01), None
patent: 0468874 (1992-01-01), None
patent: 1 041 617 (2000-10-01), None
patent: EP-1085570 (2001-03-01), None
patent: 1376678 (2004-01-01), None
patent: 1429377 (2004-06-01), None
patent: 2 767 223 (1999-02-01), None
patent: 62-094925 (1987-05-01), None
patent: 62-101678 (1987-05-01), None
patent: 3-152942 (1991-06-01), None
patent: 3-286553 (1991-12-01), None
patent: 5-287082 (1993-11-01), None
patent: 7-58132 (1995-03-01), None
patent: 9-046566 (1997-02-01), None
patent: 09-063993 (1997-03-01), None
patent: 10-242084 (1998-09-01), None
patent: 11-163193 (1999-06-01), None
patent: 11-307624 (1999-11-01), None
patent: 2000-77478 (2000-03-01), None
patent: 2000-183025 (2000-06-01), None
patent: 2000-195987 (2000-07-01), None
patent: 2000-286283 (2000-10-01), None
patent: 2001-068618 (2001-03-01), None
patent: 2001-077229 (2001-03-01), None
patent: 2001-127243 (2001-05-01), None
patent: 2001-185519 (2001-07-01), None
patent: 2001-189414 (2001-07-01), None
patent: 2001-210667 (2001-08-01), None
patent: 2002-083785 (2002-03-01), None
patent: 2002-093942 (2002-03-01), None
patent: 2002-94082 (2002-03-01), None
patent: 2002-512436 (2002-04-01), None
patent: 2002-231918 (2002-08-01), None
patent: 2002-270676 (2002-09-01), None
patent: 2002-329849 (2002-11-01), None
patent: 2003-7898 (2003-01-01), None
patent: 2003-116066 (2003-04-01), None
patent: 2005-191550 (2005-07-01), None
patent: 10-0410812 (2003-12-01), None
patent: WO-99/36958 (1999-07-01), None
patent: WO-99/40624 (1999-08-01), None
patent: WO 02/50875 (2002-06-01), None
patent: WO 02/51217 (2002-06-01), None
Thomas Luxbacher Ph. D. et al. (1999) “Spray Coating for MEMS Interconnect & Advanced Packaging Applications,” Fujifilm Interface 42ndInterface Microlithography Symposium, 5 pages.
A. Badihi (1999) “Shellcase Ultrathin Chip Size Package,” Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 236-240.
Noma, Takashi et al., U.S Office Action mailed Jul. 11, 2008, directed at U.S. Appl. No. 90/008,219; 17 pages.
Noma, Takashi et al., U.S Office Action mailed Feb. 26, 2009, directed at U.S. Appl. No. 12/133,171; 7 pages.
Noma, Takashi et al., U.S Office Action mailed Mar. 28, 2005, directed at U.S. Appl. No. 10/696,581; 10 pages.
Noma, Takashi et al., U.S Office Action mailed Apr. 16, 2008, directed at U.S. Appl. No. 10/876,532; 7 pages.
Noma, Takashi et al., U.S Office Action mailed Jul. 27, 2005, directed at U.S. Appl. No. 10/876,532; 6 pa
Kuhara Koichi
Noma Takashi
Seki Yoshinori
Shinogi Hiroyuki
Suzuki Akira
Morrison & Foerster / LLP
Pham Thanhha
Sanyo Electric Co,. Ltd.
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