Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2006-10-27

2010-06-01

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S107000, C438S113000, C438S459000, C438S460000

Reexamination Certificate

active

07727857

ABSTRACT:
To provide a thin semiconductor device having flexibility. A groove is formed in one surface of a substrate; an element layer including an element is formed, the element being disposed within the groove; the substrate is thinned from the other surface of the substrate until one surface of the element layer is exposed, to form a layer which is to be transposed, having the element; and the layer to be transposed is transposed onto the film.

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