Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2005-10-04

2008-10-28

Nguyen, Tuan H (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257S780000

Reexamination Certificate

active

07443036

ABSTRACT:
The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.

REFERENCES:
patent: 5784261 (1998-07-01), Pedder
patent: 6504241 (2003-01-01), Yanagida
patent: 6515370 (2003-02-01), Hashimoto
patent: 7122906 (2006-10-01), Doan
patent: 2004-146728 (2004-05-01), None
Chin et al. “Breakthrough Ball Attach Technology by Introducing Solder Paste Screen Printing.” IEEE 2001 Electronic Components and Technology Conference.

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