Manufacturing method of rigid-flexible printed circuit board...

Details Manufacturing method of rigid-flexible printed circuit board... Manufacturing method of rigid-flexible printed circuit board...

2006-05-02

2006-05-02

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000, C029S852000

Reexamination Certificate

active

07036214

ABSTRACT:
In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

REFERENCES:
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5939789 (1999-08-01), Kawai et al.
patent: 61-183998 (1986-08-01), None
patent: 4-53190 (1992-02-01), None
patent: 04-137591 A (1992-05-01), None
patent: 7-66557 (1995-03-01), None
patent: H7-66557 (1995-03-01), None
patent: 10-335760 (1998-12-01), None
patent: P2002-305382 (2002-10-01), None

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