Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2006-05-31
2010-02-23
Alanko, Anita K (Department: 1792)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S017000, C216S018000, C216S052000, C216S083000, C216S096000, C216S097000, C216S100000, C216S105000, C216S106000, C216S108000, C219S121690, C134S002000, C134S026000, C134S027000, C134S028000
Reexamination Certificate
active
07666320
ABSTRACT:
There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.
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Akahoshi Haruo
Arai Kunio
Kawamura Toshinori
Alanko Anita K
Hitachi Via Mechanics Ltd.
Wenderoth Lind & Ponack, LLP.
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