Manufacturing method of printed circuit board using an ink jet

Details Manufacturing method of printed circuit board using an ink jet Manufacturing method of printed circuit board using an ink jet

2007-04-13

2010-02-02

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S833000, C029S835000, C430S313000, C430S319000, C264S104000, C264S225000, C174S257000

Reexamination Certificate

active

07653990

ABSTRACT:
A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.

REFERENCES:
patent: 4137628 (1979-02-01), Suzuki
patent: 6310304 (2001-10-01), Hayama et al.
patent: 2003/0006067 (2003-01-01), Sedberry
patent: 2006/0170836 (2006-08-01), Kondo et al.
patent: 2008/0012168 (2008-01-01), Ra et al.
patent: 2008/0034581 (2008-02-01), Ra et al.
patent: 61-221392 (1986-10-01), None
patent: 2-185090 (1990-07-01), None
patent: 8-181413 (1996-07-01), None
patent: 2000-334947 (2000-12-01), None
patent: 2001-196703 (2001-07-01), None
patent: 2001-351448 (2001-12-01), None
patent: 2003-82469 (2003-03-01), None
patent: 2004-356255 (2004-12-01), None
patent: 2003-0071762 (2003-09-01), None
patent: 10-2005-0089826 (2005-09-01), None

Affiliated with

Also associated with

Rating

Manufacturing method of printed circuit board using an ink jet does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of printed circuit board using an ink jet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of printed circuit board using an ink jet will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4197303