Manufacturing method of printed circuit board

Details Manufacturing method of printed circuit board Manufacturing method of printed circuit board

2004-05-26

2010-06-01

Chang, Rick K (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C174S255000, C174S256000, C174S262000

Reexamination Certificate

active

07726016

ABSTRACT:
The present invention provides a method of manufacturing a printed circuit board. The method includes the steps of preparing an insulating substrate having a front surface and a back surface and a layer of metal foil formed on each of the front surface and the back surface; selectively forming a plating layer for forming a land on at least one of the metal foils; adjusting a thickness of the plating layer; and forming the metal foils into lines.

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Office Action Dated Apr. 13, 2009.

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