Manufacturing method of optical devices

Details Manufacturing method of optical devices Manufacturing method of optical devices

2007-01-23

2007-01-23

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S460000, C438S113000, C438S068000, C438S458000

Reexamination Certificate

active

10983940

ABSTRACT:
A first objective of the present invention is to provide a more productive method of manufacturing optical devices that minimizes processing distortion, maintains optical characteristics satisfactorily, and promotes smallness. A second objective thereof is to provide a method of manufacturing optical devices that prevents the occurrence of fine dust and maintains the optical characteristics satisfactorily. A third objective thereof is to provide a method of manufacturing optical devices of a multi-layer configuration that are obtained by applying a scribing/cutting method. A method of manufacturing optical devices in accordance with the present invention, wherein an optical wafer having surfaces polished to a mirror finish is divided into a plurality of optical chips, is provided with a first step of providing hairline cracks by a diamond blade edge in one main surface of the optical wafer and a third step of applying pressure along the hairline cracks after the first step, to divide the optical wafer into the plurality of optical chips.

REFERENCES:
patent: 4904617 (1990-02-01), Muschke
patent: 5314844 (1994-05-01), Imamura
patent: 5418190 (1995-05-01), Cholewa et al.
patent: 6830946 (2004-12-01), Yanagisawa et al.
patent: 2005/0056127 (2005-03-01), Yamabuchi et al.
patent: 6-313811 (1994-11-01), None

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