Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2007-04-12
2010-10-05
Van, Luan V (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S181000
Reexamination Certificate
active
07807034
ABSTRACT:
A manufacturing method of a non-etched circuit board is disclosed herein, which employs a metal substrate having a metal barrier layer and an electroplated copper layer to transmit an electrical current to form a circuit layer. A patterned photoresist layer is formed on the electroplated copper layer to define the location of the circuit layer and form circuits or conductive via on the board by electroplating. An electroplated nickel layer or an electroplated gold layer is further formed on the circuit layer for protecting the circuits and improving the fine line capability. During or after the process, the metal substrate, the metal barrier layer, and the electroplated copper layer are removed to enlarge the wiring space, so that a high-density circuit board can be obtained.
REFERENCES:
patent: 6969674 (2005-11-01), Chang et al.
Kinsus Interconnect Technology Corp.
Van Luan V
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