Manufacturing method of liquid discharge head and orifice plate

Details Manufacturing method of liquid discharge head and orifice plate Manufacturing method of liquid discharge head and orifice plate

2011-06-07

2011-06-07

Alanko, Anita K (Department: 1713)

Etching a substrate: processes

Forming or treating thermal ink jet article

C029S025350, C029S890100, C438S021000

Reexamination Certificate

active

07955509

ABSTRACT:
There is disclosed a manufacturing method in which depths of individual liquid chambers can be set to be small. The manufacturing method is a manufacturing method of a liquid discharge head having a liquid chamber which communicates with a discharge port for discharging a liquid, and includes: etching a first Si layer of an SOI substrate by use of an insulating layer as an etching stop layer to form the liquid chamber at the first Si layer, the SOI substrate being constituted by the first Si layer, the insulating layer and a second Si layer in this order; and removing a part or all of the second Si layer.

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