Manufacturing method of liquid crystal display element and...

Printing – Work supporting members – Work held on flat surface

Reexamination Certificate

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C269S021000, C248S362000

Reexamination Certificate

active

06272989

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to manufacturing methods of liquid crystal display elements used in a liquid crystal display element manufacturing process and manufacturing apparatuses of the same, and in particular to a resist applying apparatus, an exposure apparatus, a rubbing apparatus, a spacer dispersion apparatus, a seal printing apparatus, and the like.
BACKGROUND OF THE INVENTION
Conventional liquid crystal display elements include a glass substrate typically having dimensions of about 300 mm×400 mm×0.7 mm. Recent liquid crystal display elements include a larger glass substrate of a 400 mm or 500 mm size.
In a manufacturing process of such liquid crystal display elements, the glass substrate is moved past, for example, a resist applying apparatus, an exposure apparatus, an orientation film printing apparatus, a spacer dispersion apparatus, a seal printing apparatus, and the like. During operation by the apparatus, the glass substrate
51
is fixed onto a flat upper surface of a support table (hereinafter will be referred to as a stage)
52
by vacuum attraction as shown in
FIGS. 6 and 7
.
Specifically, the stage
52
has attraction openings
53
having a diameter of about 0.5 mm to 1.0 mm arrayed in a matrix form with intervals of about 5 mm to 30 mm. The attraction openings
53
are connected via a linking passage
54
to a vacuum pump
55
disposed underneath the stage
52
. The glass substrate
51
is attracted by vacuum attractive forces exerted simultaneously across nearly the entire glass substrate
51
at the attraction openings
53
, and thus fixed onto the stage
52
.
The glass substrate
51
, made to be like a flat panel with superb flatness and rigidity, dose not warp and is fixed onto the stage
52
uniformly even if attractive forces are exerted in a discrete manner thereonto at the attraction openings
53
simultaneously as explained above. As a result, for example, in the orientation film printing treatment of the manufacturing process of a liquid crystal display element, an orientation film is uniformly applied with no printing irregularities such as convexities and concavities in the finished state.
Moreover, as disclosed in Japanese Laid-Open Patent Application No. 9-80404/1997 (Tokukaihei 9-80404), a slightly bent glass substrate
51
having a thickness of about 0.7 mm can be attracted without vacuum breakdown by vacuuming several regions with time shifts using a vacuum pump and a switching valve because of the weight of the glass substrate
51
itself.
The glass substrate
51
is disposed on the stage
52
by being positioned properly in a cassette loaded with a plurality of glass substrates
51
by means of positioning pins and the like and then placed on lift pins standing on the stage
52
by a transport arm and the like.
The glass substrate
51
is then placed on the stage
52
by lowering the lift pins and fixed onto the stage
52
by exerting vacuum attractive forces at the attraction openings
53
either simultaneously or with time shifts using the switching valve and the like as described above.
Thereafter, for example, in an orientation film printing apparatus and a seal printing apparatus, highly precise positioning is conducted using a CCD camera, alignment marks formed in advance on the glass substrate
51
, etc. before proceeding to a further process.
A different attraction method, using a blower, is disclosed in Japanese Laid-Open Patent Applications No. 8-324786/1996 (Tokukaihei 8-324786) and No. 7-33281/1995 (Tokukaihei 7-33281).
In addition, thin-type glass substrates and thin-type plastic substrates made of plastic having a thickness of 0.7 mm or less are employed in recent development for thinner and lighter liquid crystal display elements, and some of them are already available for commercial use. The aforementioned attracting method is used for those thin-type glass substrates and plastic substrates.
However, there are problems with the attracting methods for thin insulating substrates such as the glass substrates and plastic substrates above.
When the insulating substrate is fixed onto a stage by exerting vacuum attractive forces at attraction openings either simultaneously or with time shifts as disclosed in Japanese Laid-Open Patent Application No. 980404/1997 after lowering the lift pins and thus placing the insulating substrate on the stage, air is sucked between the insulating substrate and the stage through the attraction openings. The air flow generates static electricity and may cause the insulating substrate to slide on the stage as much as 1 cm.
Especially, the thin-type glass substrate and plastic substrate having a thickness of 0.7 mm or less, being lighter than glass substrates having a thickness exceeding 0.7 mm, exert less pressure on the stage and are more likely to be displaced.
Such movement of the insulating substrate may push the alignment marks out of the visible area for the CCD camera and the like, causing the CCD camera and the like to fail to recognize the alignment marks and to conduct highly precise positioning.
Moreover, if the thin-type glass substrate or plastic substrate is heated to remain at a temperature higher than room temperature while undergoing treatments in apparatuses or transported from one apparatus to another, irregular temperatures inside the apparatuses cause the substrate to have non-uniform temperature. The substrate consequently may warp, undulate, or bend entirely or partially.
Depending upon the treatment, the deformation may become of a perpetual nature or disappear after the treatment, which renders the substrate back into the flat shape. Sometimes, the substrate is deformed in various manners during a treatment. The extent, direction, and location of such deformation also may be perpetuated, disappear after the treatment, and vary constantly during the treatment. Even if the temperature inside the apparatus is consistent, the deformations happen while raising or lowering the temperature of the substrate before or after the treatment and conducting a series of treatments at different temperatures.
If that deformation happens, when the thin-type glass substrate or plastic substrate is fixed onto a stage by exerting vacuum attractive forces at attraction openings either simultaneously or with time shifts after lowering the lift pins and thus placing the substrate on the stage, the substrate cannot be attracted at the first instance. Otherwise, although being attracted at the first instance, the substrate may come off later as the attractive forces yield to the deformation of the substrate and cause the vacuum to break down.
Especially the thin-type glass substrate and plastic substrate are less rigid than glass substrates having the same size but a thickness exceeding 0.7 mm, the rigidity being less likely to overcome the deformation. Therefore, the thin-type glass substrate and plastic substrate are easier to deform and more difficult to attract.
In addition, the thin-type glass substrate and plastic substrate are lighter than glass substrates having the same size but a thickness exceeding 0.7 mm. If the warp exceeds a certain level (1 mm to 2 mm in a convex shape or in four directions for a substrate of about 300 mm×400 mm), the weight of the substrate cannot overcome the warp and render the substrate back into the flat shape, and the substrate therefore cannot be attracted onto the stage.
If the substrate is not attracted onto the stage, post-treatments such as alignment cannot be conducted.
Meanwhile, plastic substrates having a thickness of 0.4 mm or less and a plastic film having a thickness of 0.3 mm or less are even less rigid and susceptible to deformation and undulation even without being heated. This is a self-bending phenomena or so-called droop: when a part of the substrate is supported, the remaining part of the substrate, not supported, bends because the rigidity thereof yields to the weight thereof.
If the orientation state of the molecules of the material constituting the substrate or a physical or chemical property of

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