Manufacturing method of light emitting diode including...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

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Details

C438S042000, C438S047000, C257SE33005, C257SE33006, C257SE33011

Reexamination Certificate

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07998771

ABSTRACT:
Provided is a method of manufacturing a light emitting diode using a nitride semiconductor, which including the steps of: forming n- and p-type current spreading layers using a hetero-junction structure; forming trenches by dry-etching the n- and p-type current spreading layers; forming an n-type metal electrode layer in the trench of the n-type current spreading layer; forming a p-type metal electrode layer in the trench of the p-type current spreading layer; and forming a transparent electrode layer on the p-type metal electrode layer, thereby improving current spreading characteristics as compared with the conventional method of manufacturing the light emitting diode, and enhancing operating characteristics of the light emitting diode.

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Kim K. H. et al., “III-nitride ultraviolet light-emitting diodes with delta doping”, Applied Physics Letters, Jul. 21, 2003, vol. 83, No. 3, pp. 566-568.

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