Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-01-11
2011-01-11
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S034000, C257SE21599, C257SE21510
Reexamination Certificate
active
07867795
ABSTRACT:
A manufacturing method of a light emitting diode (LED) apparatus includes the steps of: forming at least one temporary substrate, which is made by a curable material, on a LED device; and forming at least a thermal-conductive substrate on the LED device. The manufacturing method does not need the step of adhering the semiconductor structure onto another substrate by using an adhering layer, and can make the devices to be in sequence separated after removing the temporary substrate, thereby obtaining several LED apparatuses. As a result, the problem of current leakage due to the cutting procedure can be prevented so as to reduce the production cost and increase the production yield.
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Chen Chao-Min
Chen Huang-Kun
Chen Shih-Peng
Shiue Ching-Chuan
Delta Electronics , Inc.
Everhart Caridad M
Muncy Geissler Olds & Lowe, PLLC
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