Manufacturing method of light emitting diode

Details Manufacturing method of light emitting diode Manufacturing method of light emitting diode

2010-03-05

2011-11-08

Chaudhari, Chandra (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S113000, C257SE21499

Reexamination Certificate

active

08053259

ABSTRACT:
Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.

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Notice of Allowance issued on Dec. 24, 2009 in co-pending U.S. Appl. No. 12/064,950.
Extended European Search Report issued Apr. 19, 2010 by the European Patent Office in European Patent Application No. 06783634.6.

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