Manufacturing method of light emitting device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

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C438S022000, C438S045000

Reissue Patent

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RE042074

ABSTRACT:
A method of manufacturing a light emitting device, including the steps of: forming an active layer composed of a compound semiconductor containing indium by a vapor phase growth method; and forming a cap layer composed of a compound semiconductor on said active layer by a vapor phase growth method at a growth temperature approximately equal to or lower than a growth temperature for said active layer.

REFERENCES:
patent: 5247533 (1993-09-01), Okazaki et al.
patent: 5290393 (1994-03-01), Nakamura
patent: 5345463 (1994-09-01), Mannoh et al.
patent: 5393993 (1995-02-01), Edmond et al.
patent: 5495155 (1996-02-01), Juzswik et al.
patent: 5563422 (1996-10-01), Nakamura et al.
patent: 5578839 (1996-11-01), Nakamura et al.
patent: 5583878 (1996-12-01), Shimizu et al.
patent: 5592501 (1997-01-01), Edmond et al.
patent: 5656832 (1997-08-01), Ohba et al.
patent: 5770887 (1998-06-01), Tadatomo et al.
patent: 5777350 (1998-07-01), Nakamura et al.
patent: 5780876 (1998-07-01), Hata
patent: 5866440 (1999-02-01), Hata
patent: 5903017 (1999-05-01), Itaya et al.
patent: 5959307 (1999-09-01), Nakamura et al.
patent: 5990496 (1999-11-01), Kunisato et al.
patent: 6072818 (2000-06-01), Hayakawa
patent: 6081001 (2000-06-01), Funato et al.
patent: 6147364 (2000-11-01), Itaya et al.
patent: 6162656 (2000-12-01), Kunisato et al.
patent: 6165812 (2000-12-01), Ishibashi et al.
patent: 1132942 (1996-10-01), None
patent: 341718 (1998-10-01), None
patent: 0 716 457 (1966-06-01), None
patent: 0 497 350 (1992-08-01), None
patent: 0 497 350 (1992-08-01), None
patent: 762516 (1997-03-01), None
patent: 61-131582 (1986-06-01), None
patent: 4-297023 (1992-10-01), None
patent: 4-321280 (1992-11-01), None
patent: 6-21511 (1994-01-01), None
patent: 6-53549 (1994-02-01), None
patent: 6-164055 (1994-06-01), None
patent: 6-216409 (1994-08-01), None
patent: 6-283825 (1994-10-01), None
patent: 7-015041 (1995-01-01), None
patent: 7-074431 (1995-03-01), None
patent: 07-106698 (1995-04-01), None
patent: 7-162038 (1995-06-01), None
patent: 7-235723 (1995-09-01), None
patent: 7-249795 (1995-09-01), None
patent: 7-267796 (1995-10-01), None
patent: 7-302929 (1995-11-01), None
patent: 7-307338 (1995-11-01), None
patent: 8-18159 (1996-01-01), None
patent: 8-070139 (1996-03-01), None
patent: 8-293643 (1996-11-01), None
patent: 9-64419 (1997-03-01), None
patent: 9-97921 (1997-04-01), None
patent: 9-148247 (1997-06-01), None
patent: 9-148678 (1997-06-01), None
patent: 9-186363 (1997-07-01), None
patent: 9-199798 (1997-07-01), None
patent: 9-232680 (1997-09-01), None
patent: 9-232685 (1997-09-01), None
patent: 9-266352 (1997-10-01), None
patent: 9-283854 (1997-10-01), None
patent: 9-293897 (1997-11-01), None
patent: 9-293935 (1997-11-01), None
patent: 10-126006 (1998-05-01), None
patent: 9-055221 (2003-02-01), None
patent: WO 95/17019 (1995-06-01), None
patent: WO 97/26680 (1997-07-01), None
The First Notice of Reasons for Refusal in the counterpart Japanese application (JP9-055221) dated Jul. 6, 2001 and its translation thereof.
The Second Notice of Reasons for Refusal in the counterpart Japanese application (JP9-055221) dated Nov. 6, 2001 and its translation thereof.
The Third Notice of Reasons for Refusal in the counterpart Japanese application (JP9-055221) dated Mar. 19, 2002 and its translation thereof.
The Fourth Notice of Reasons for Refusal in the counterpart Japanese application (JP9-055221) dated Jul. 30, 2002 and its translation thereof.
The Office Action is the counterpart Chinese application (97110806.4) dated Oct. 11, 2002.
The Decision of Refusal in the counterpart Japanese application (JP107834) and its translation; Mar. 16, 2004.
The Notice of Reasons for Revocation in the counterpart Japanese application (JP2004-079216) and its translation.
J. Appln Phys., vol. 74m No. 6, pp. 3911-3915.
JPN. J. Appl. Phys., vol. 35, pp. L74-L76.
Compound Semiconductor Jan./Feb., p. 7, 1996.
Shuji Nakamura et al., Jpn. J. Appl. Phys. Lett. 69(10) pp. L1477-L1479, Sep. 2, 1996.
Shuji Nakamura et al., Jpn. J. Appl. Phys. vol. 35, pp. L217-L220 Part 2, No. 2B, Feb. 15, 1996.
Shuji Nakamura et al., “Superbright green InGaN single-quantum-well-structure LEDs” Jpn. J. Appl. Phys. Lett, Part 2, Oct. 15, 1995, Japan, vol. 34, No. 10B, pp. L1332-L1335, XP 000 702227.
Shuji Nakamura et al., “III-V nitride-based LEDs” Conf. On Diamond, Diamond-Like and Related Materials, Barcelona, Sep. 10-15, 1995, vol. 5, No. 3-5, pp. 496-500, XP 000 627554.
Notification of Reasons for Refusal dated Mar. 27, 2007 issued in corresponding Japanese Application JP 2003-114877.
Japanese Office Action dated Mar. 31, 2009, issued in Japanese Application No. 2001-267038.
Japanese Office Action mailed Aug. 19, 2008, issued in corresponding Japanese Application No. 2001-267038.
Japanese Office Action dated Jan. 12, 2010, issued in corresponding Japanese Application No. 2001-267038 (With English Translation).
Shuji Nakamura et al.; Jpn. J. Appl. Phys. vol. 35, pp. L74-L76, Part. 1, No. 1B; Jan. 15, 1996.
Questioning dated Aug. 3, 2010, issued by the Board of appeals in the counterpart Japanese Application No. 2001-007643.

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