Manufacturing method of encapsulating semiconductor device using

Details Manufacturing method of encapsulating semiconductor device using Manufacturing method of encapsulating semiconductor device using

1994-03-22

1995-06-13

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437207, 437209, 437219, 257788, 257790, 2641771, 2642092, 264284, 264293, H01L 2156

Patent

active

054242509

ABSTRACT:
A method for manufacturing a semiconductor device in which two resin encapsulating sheets, each having a convex portion, are brought into contact with a semiconductor chip. The semiconductor chip is then encapsulated by pressing the chip between the encapsulating sheets.

REFERENCES:
patent: 3911475 (1975-10-01), Szedon et al.
patent: 5083191 (1992-01-01), Ueda

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