Manufacturing method of electronic device

Details Manufacturing method of electronic device Manufacturing method of electronic device

2007-11-13

2009-10-20

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S113000, C438S114000, C438S126000, C257SE21505

Reexamination Certificate

active

07605021

ABSTRACT:
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting a circuit chip on the base through the thermosetting adhesive; holding the base while pressing a circuit chip side of the base and a film side of the base by a heating apparatus that heats the thermosetting adhesive; giving a tension to the base on which the circuit chip is mounted; and heating the thermosetting adhesive by the heating apparatus to cure the thermosetting adhesive, thereby fixing the circuit chip to the conductive pattern.

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