Manufacturing method of electronic circuit including...

Details Manufacturing method of electronic circuit including... Manufacturing method of electronic circuit including...

2005-05-10

2005-05-10

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S025420, C029S846000, C204S192100, C361S763000

Reexamination Certificate

active

06889431

ABSTRACT:
The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.

REFERENCES:
patent: 4624737 (1986-11-01), Shimbo
patent: 5822175 (1998-10-01), Azuma
patent: 6005197 (1999-12-01), Kola et al.
patent: 6757178 (2004-06-01), Okabe et al.
patent: 7-16099 (1995-02-01), None

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