Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-11-14
2010-10-05
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S829000, C029S848000, C427S097100, C427S256000
Reexamination Certificate
active
07805836
ABSTRACT:
A manufacturing method of an electronic board includes: placing an electronic component including conductive parts on a first insulation layer with the conductive parts facing up as well as providing projections having conductivities on the conductive parts; applying an insulation material by means of a droplet discharging method providing a second insulation layer on an upper surface of the electronic component while dodging the projections, the second insulation layer having a height the projections project out from the layer; providing conductive wirings to be connected to the projections on the second layer; and applying the insulation material around the electronic component by means of the droplet discharging method to provide a third insulation layer having a height generally equal to the second insulation layer.
REFERENCES:
patent: 7192859 (2007-03-01), Yamazaki et al.
patent: 2006/0045962 (2006-03-01), Miura
patent: 2005-251910 (2005-09-01), None
patent: 2005-327985 (2005-11-01), None
patent: 2006-066494 (2006-03-01), None
patent: 2006-287008 (2006-10-01), None
Phan Thiem
Seiko Epson Corporation
Workman Nydegger
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