Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent
1996-09-30
1999-01-12
Trinh, Michael
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
438 3, 438240, 438253, 438653, H01L 218242
Patent
active
058588515
ABSTRACT:
A titanium film and a titanium nitride film are sequentially formed on a polysilicon plug. Next, the titanium nitride film is oxidized to form an oxidized titanium nitride film. Thereafter, a lower electrode and a PZT film are formed. A diffusion barrier layer is prepared from the oxidized titanium nitride film and is oxidized before the lower electrode is formed. As a result, unlike in prior art, the diffusion barrier layer is not oxidized after the lower electrode is formed. Peel-off between the diffusion barrier layer and the lower electrode due to the oxidation is thus prevented.
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Kudo Jun
Onishi Shigeo
Yamagata Satoru
Sharp Kabushiki Kaisha
Thomas Toniae M.
Trinh Michael
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