Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-03-07
2006-03-07
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C349S114000
Reexamination Certificate
active
07008807
ABSTRACT:
A photosensitive resin applied onto a substrate is exposed using a mask. In this exposure step, by appropriately setting the size of each light transmitting portion formed in the mask and an exposure gap, an exposure intensity profile on a surface of a photosensitive resin is formed so as to have an increasing and decreasing curve along the surface thereof. When the exposure is performed in accordance with the exposure intensity profile, followed by development, a resin layer having surface irregularities is formed. Subsequently, a reflection layer made of a metal thin film or the like is formed on this resin layer.
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Communication from Korean Patent Office regarding related application.
Communication from Japanese Patent Office re: related application.
Matsuo Mutsumi
Otake Toshihiro
Dolan Jennifer M
Schillinger Laura M.
Seiko Epson Corporation
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