Manufacturing method of double-sided wiring glass substrate

Details Manufacturing method of double-sided wiring glass substrate Manufacturing method of double-sided wiring glass substrate

2011-08-09

2011-08-09

Van, Luan V (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

Reexamination Certificate

active

07993509

ABSTRACT:
To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film layer is formed by first forming an electroless plating copper layer and then forming an electrolytic plating copper layer on a sidewall of the through-hole. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

REFERENCES:
patent: 3646572 (1972-02-01), Burr
patent: 5262041 (1993-11-01), Gulla
patent: 5911863 (1999-06-01), Vetter et al.
patent: 6199273 (2001-03-01), Kubo et al.
patent: 6339197 (2002-01-01), Fushie et al.
patent: 6852627 (2005-02-01), Sinha et al.
patent: 2002/0004301 (2002-01-01), Chen et al.
patent: 2002/0066672 (2002-06-01), Iijima et al.
patent: 2002/0170173 (2002-11-01), Mashino
patent: 2002/0192939 (2002-12-01), Sugihara
patent: 2006/0201201 (2006-09-01), Fushie et al.
patent: 42 01 612 (1993-07-01), None
patent: 63-128699 (1988-06-01), None
patent: 03203341 (1991-09-01), None
patent: 6-275954 (1994-09-01), None
patent: 11-177200 (1999-07-01), None
patent: 11177200 (1999-07-01), None
patent: 2000-077568 (2000-03-01), None
patent: 2000-77809 (2000-03-01), None
patent: 2000077809 (2000-03-01), None
patent: 2000-133945 (2000-05-01), None
patent: 2001-44639 (2001-02-01), None
patent: 2003-060330 (2003-02-01), None
International Search Report of International Application PCT/JP2004/012720 mailed Nov. 16, 2004.
Supplementary European Search Report dated Apr. 20, 2009, issued in corresponding European Patent Application No. 04772674.0-1232.
Supplementary European Search Report dated Apr. 20, 2009, issued in corresponding European Patent Application No. 04772673.2-1232.

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