Manufacturing method of ball grid array package

Details Manufacturing method of ball grid array package Manufacturing method of ball grid array package

2006-03-21

2006-03-21

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S734000, C257S735000, C257S736000

Reexamination Certificate

active

07015065

ABSTRACT:
A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of the carrier unit, disposing a protective layer below the lower surface to cover the solder balls, placing a chip on the upper surface of the carrier unit and electrically connecting the carrier and the chip, encapsulating the chip and removing the protective layer so as to form said ball grid array package.

REFERENCES:
patent: 6762498 (2004-07-01), Morrison et al.
patent: 6774497 (2004-08-01), Qi et al.
patent: 6825108 (2004-11-01), Khan et al.
patent: 6861294 (2005-03-01), Tsunoda et al.
patent: 6903442 (2005-06-01), Wood et al.
patent: 2002/0110956 (2002-08-01), Kumamoto et al.
patent: 2004/0041260 (2004-03-01), Wood et al.

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