Manufacturing method of an electronic part built-in substrate

Details Manufacturing method of an electronic part built-in substrate Manufacturing method of an electronic part built-in substrate

2007-05-08

2007-05-08

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C438S109000, C438S110000, C438S508000

Reexamination Certificate

active

11203700

ABSTRACT:
A manufacturing method of an electronic part built-in substrate is disclosed, wherein an electronic part is contained in a build-up layer, the manufacturing method includinga step for arranging an electronic part on a conductive supporting object such that the electronic part is electrically connected to the conductive supporting object,a step for forming build-up layers on the supporting object such that the electronic part is contained in the build-up layers, anda step for forming a wiring layer electrically connected to the electronic part by shaping the supporting object.

REFERENCES:
patent: 6914322 (2005-07-01), Iijima et al.
patent: 2003/0111734 (2003-06-01), Kobayashi et al.
patent: 2003 197809 (2003-07-01), None

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