Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-05-20
2008-05-20
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S017000, C438S460000
Reexamination Certificate
active
07374970
ABSTRACT:
The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved.
REFERENCES:
patent: 6002266 (1999-12-01), Briggs et al.
patent: 6064217 (2000-05-01), Smith
patent: 6472892 (2002-10-01), Pochmuller
patent: 7093358 (2006-08-01), Akram et al.
patent: 7101735 (2006-09-01), Noma et al.
patent: 11-011572 (1999-01-01), None
Antonelli, Terry Stout & Kraus, LLP.
Picardat Kevin M
Renesas Technology Corp.
LandOfFree
Manufacturing method of a tray, a socket for inspection, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method of a tray, a socket for inspection, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of a tray, a socket for inspection, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2812042