Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1997-07-02
1999-09-14
Bowers, Charles
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438151, 438158, 257 72, 257506, H01L 21306, H01L 2184
Patent
active
059535830
ABSTRACT:
A thin-film transistor of the reversed stagger type is provided with a gate electrode, first and second gate insulating films, a semiconductor layer, separated contact layers, and source electrodes and drain electrodes, all of which are stacked on a substrate. Upon manufacturing the thin-film transistor of this type, a gap section is pattered in a single contact-material layer. In this case, the contact-material layer is patterned by carrying out etching by the use of the source electrode and drain electrode as direct masks or by the use of a resist pattern that was used for forming the respective electrodes. Upon patterning a gap section in the contact-material layer between the source electrode and the drain electrode, no dedicated resist pattern is required; therefore, it is possible to reduce the number of the processes as compared with conventional manufacturing methods. Consequently, it becomes possible to reduce the production cost of thin-film transistors and also to improve the yield of desired products.
REFERENCES:
patent: 4680086 (1987-07-01), Thomas et al.
patent: 4778560 (1988-10-01), Takeda et al.
patent: 5017984 (1991-05-01), Tanaka et al.
patent: 5036370 (1991-07-01), Miyago et al.
patent: 5109260 (1992-04-01), Tanaka et al.
patent: 5352907 (1994-10-01), Matsuda et al.
patent: 5585647 (1996-12-01), Nakajima et al.
patent: 5736434 (1998-04-01), Konuma et al.
patent: 5831694 (1996-06-01), Onisawa et al.
S. M. Sze, VLSI Technology, pp.221-226, 1988.
Stanley Wolf and Richard N. Tauber, silicon Processing for the VLSI Era, pp.539-581, 1986.
Ban Atsushi
Okamoto Masaya
Suzuki Hisataka
Bowers Charles
Sharp Kabushiki Kaisha
Sulsky Martin
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