Manufacturing method of a semiconductor device to suppress...

Details Manufacturing method of a semiconductor device to suppress... Manufacturing method of a semiconductor device to suppress...

2006-02-28

2009-06-16

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S611000, C029S827000, C257S772000, C257SE23031, C257SE23053

Reexamination Certificate

active

07547581

ABSTRACT:
It is suppressed that a whisker occurs on a lead for external connection.A lead for external connection is formed of the alloy (42Alloy) of Fe and Ni, and a plating film which includes alloy of Sn and Cu is formed on the surface. Next, using a heat-treat furnace, the heat treatment at the temperature beyond melting-point T0of the plating film is performed, and the plating film is melted. At this time, the temperature beyond T0is held for 20 seconds or more. The grain boundary of the plating film can be vanished by the above-mentioned heat treatment. Hereby, the internal stress of the plating film can be eased, and the generation of the whisker can be suppressed.

REFERENCES:
patent: 5329158 (1994-07-01), Lin
patent: 6313412 (2001-11-01), Trumble et al.
patent: 6478944 (2002-11-01), Ishiyama
patent: 6545344 (2003-04-01), Abbott
patent: 6891253 (2005-05-01), Miyaki et al.
patent: 6960823 (2005-11-01), Miyaki et al.
patent: 2002/0053721 (2002-05-01), Kubara et al.
patent: 01305551 (1989-12-01), None
patent: 2002-69688 (2002-03-01), None
patent: 2002-368175 (2002-12-01), None
patent: 2004-200249 (2004-07-01), None
Selective Plating for Surface-Mounted Component Lead, Sep. 1986, IBM Techinical Disclosure Bulletin, vol. 29,pp. 1652-1653.

Affiliated with

Also associated with

Rating

Manufacturing method of a semiconductor device to suppress... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of a semiconductor device to suppress..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of a semiconductor device to suppress... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4085347