Manufacturing method of a semiconductor device incorporating...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

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Reexamination Certificate

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06995044

ABSTRACT:
A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

REFERENCES:
patent: 5055907 (1991-10-01), Jacobs
patent: 5192716 (1993-03-01), Jacobs
patent: 5654590 (1997-08-01), Kuramochi
patent: 6294407 (2001-09-01), Jacobs
patent: 2002/0180013 (2002-12-01), Brofman et al.
patent: 3-246993 (1991-11-01), None
patent: 4-291993 (1992-10-01), None
patent: 5-259639 (1993-10-01), None
patent: 7-321490 (1995-12-01), None
patent: 2000-306771 (2000-11-01), None
patent: 2001-36236 (2001-02-01), None
patent: 2001-274036 (2001-10-01), None

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