Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-04-05
2005-04-05
Zarneke, David A. (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
Reexamination Certificate
active
06875638
ABSTRACT:
A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.
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Fujimoto Yasunori
Ihara Takumi
Imamura Kazuyuki
Kikuchi Atsushi
Kuriki Yukihiro
Westerman Hattori Daniels & Adrian LLP
Zarneke David A.
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