Manufacturing method of a package structure

Details Manufacturing method of a package structure Manufacturing method of a package structure

2006-12-13

2008-10-28

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S462000

Reexamination Certificate

active

07442580

ABSTRACT:
A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material layer is formed on the surface of the substrate. Next, a this film is pasted on the packing material layer. Then the substrate and the packing material layer are thoroughly cut along a cutting line around the chip by a first cutting blade but the thin film is not cut thoroughly. Next, the substrate is thoroughly cut along at least a part of the cutting line by a second cutting blade but the packing material layer is not thoroughly cut such that a part of the packing material layer is exposed. The width of the second cutting blade is larger than the width of the first cutting blade.

REFERENCES:
patent: 5989982 (1999-11-01), Yoshikazu
patent: 6074896 (2000-06-01), Dando
patent: 6281047 (2001-08-01), Wu et al.
patent: 6737300 (2004-05-01), Ding et al.
patent: 6849523 (2005-02-01), Chao et al.
patent: 7091109 (2006-08-01), Fujii et al.
patent: 7241642 (2007-07-01), Hurtado
patent: 2002/0098620 (2002-07-01), Ding et al.
patent: 2007/0117259 (2007-05-01), Anderson et al.
patent: 2007/0190691 (2007-08-01), Humpston et al.
patent: 2007/0224732 (2007-09-01), Weng et al.
patent: 2008/0001241 (2008-01-01), Tuckerman et al.
patent: 2008/0002460 (2008-01-01), Tuckerman et al.
patent: 2008/0029879 (2008-02-01), Tuckerman et al.

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