Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-12-13
2008-10-28
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C438S462000
Reexamination Certificate
active
07442580
ABSTRACT:
A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material layer is formed on the surface of the substrate. Next, a this film is pasted on the packing material layer. Then the substrate and the packing material layer are thoroughly cut along a cutting line around the chip by a first cutting blade but the thin film is not cut thoroughly. Next, the substrate is thoroughly cut along at least a part of the cutting line by a second cutting blade but the packing material layer is not thoroughly cut such that a part of the packing material layer is exposed. The width of the second cutting blade is larger than the width of the first cutting blade.
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Lee Cheng-Yin
Weng Gwo-Liang
Advanced Semiconductor Engineering Inc.
Birch & Stewart Kolasch & Birch, LLP
Menz Laura M
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