Manufacturing method of a multilayer printed wiring board

Details Manufacturing method of a multilayer printed wiring board Manufacturing method of a multilayer printed wiring board

2007-11-06

2007-11-06

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S837000, C029S846000, C174S250000, C174S252000, C174S261000, C174S262000, C257S713000

Reexamination Certificate

active

11002135

ABSTRACT:
A conductive film has a plurality of clearances (openings) and a plurality of auxiliary clearances. The plurality of clearances and the plurality of auxiliary clearances are formed to have such numerical apertures and locations that generate no bias in the distribution of conductive film in consideration of the entire conductive film. The conductive film can disperse stress caused by thermal expansion etc., to ease by having the plurality of clearances and the plurality of auxiliary clearances. Accordingly, the conductive film is less prone to being peeled off the insulating film. Further, since the distribution of conductive film is substantially uniform as a whole, the transfer characteristics that are fixed by the distribution become substantially uniform as a whole.

REFERENCES:
patent: 4739448 (1988-04-01), Rowe et al.
patent: 5315069 (1994-05-01), Gebara
patent: 5415720 (1995-05-01), Schonhammer et al.
patent: 6184478 (2001-02-01), Imano et al.
patent: 6388206 (2002-05-01), Dove et al.
patent: 6486414 (2002-11-01), Kobayashi et al.
patent: 6521842 (2003-02-01), Brinthaupt, III et al.
patent: 6727435 (2004-04-01), Egan et al.
patent: 55-156393 (1980-12-01), None
patent: 57-149789 (1982-09-01), None
patent: 59-161897 (1984-09-01), None
patent: 61-220398 (1986-09-01), None
patent: 7-302979 (1995-11-01), None
patent: 2000-101237 (2000-04-01), None

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