Manufacturing method for wiring substrates

Details Manufacturing method for wiring substrates Manufacturing method for wiring substrates

2006-10-03

2006-10-03

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Groove formation

C438S057000, C438S308000, C438S535000

Reexamination Certificate

active

07115435

ABSTRACT:
A manufacturing method for wiring substrates for photographing a positioning mark formed with a high precision using reflected light and executing a relative positioning operation between a wiring substrate workpiece and an exposure mask based thereon. The method steps include successively laminating a conductor layer and dielectric layer on a plate-like core and forming a positioning mark by irradiating the main surface of dielectric layer with laser light. By irradiating the positioning mark with position detecting light from the side of the main surface of the dielectric layer and detecting reflected light, relative positioning between the wiring substrate workpiece and the exposure mask is based on the detection result.

REFERENCES:
patent: 5136152 (1992-08-01), Lee
patent: 6853042 (2005-02-01), Yoshida et al.
patent: 2001/0046200 (2001-11-01), Saeki
patent: 2001-217546 (2001-08-01), None
patent: 2001-251051 (2001-09-01), None

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