Manufacturing method for wiring circuit substrate

Details Manufacturing method for wiring circuit substrate Manufacturing method for wiring circuit substrate

2006-08-29

2006-08-29

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S874000, C029S884000, C438S616000, C438S612000

Reexamination Certificate

active

07096578

ABSTRACT:
A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas and to form protrusions in other areas which extend above the etched areas. An interlayer-insulating layer is formed to overlie the etched areas of the first metal layer. The interlayer-insulating layer has an inner surface which confronts the etched first areas and an outer surface remote from the inner surface, such that the protrusions extend through the interlayer-insulating layer and have ends exposed at the outer surface. A second metal layer is then provided in conductive communication with the exposed ends of the protrusions, and the first and second metal layers are selectively patterned from surfaces remote from the interlayer-insulating layer.

REFERENCES:
patent: 3488429 (1970-01-01), Boucher
patent: 3605260 (1971-09-01), Spridco et al.
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5108541 (1992-04-01), Schneider et al.
patent: 5426850 (1995-06-01), Fukutomi et al.
patent: 5464662 (1995-11-01), Murakami et al.
patent: 5637834 (1997-06-01), La Bate, Jr. et al.
patent: 5650595 (1997-07-01), Bentlage et al.
patent: 5822850 (1998-10-01), Odaira et al.
patent: 5948533 (1999-09-01), Gallagher et al.
patent: 5950306 (1999-09-01), Suzuki et al.
patent: 6237218 (2001-05-01), Ogawa et al.
patent: 6262376 (2001-07-01), Hurwitz et al.
patent: 6262478 (2001-07-01), Hurwitz et al.
patent: 6280640 (2001-08-01), Hurwitz et al.
patent: 6310391 (2001-10-01), Nagasawa et al.
patent: 6381837 (2002-05-01), Baker et al.
patent: 6528874 (2003-03-01), Iijima et al.
patent: 6646337 (2003-11-01), Iijima
patent: 6782610 (2004-08-01), Iijima et al.
patent: 6828221 (2004-12-01), Iijima et al.
patent: 6884709 (2005-04-01), Iijima et al.
patent: 195 15 159 (1995-11-01), None
patent: 0 457 501 (1991-11-01), None
patent: 0 805 614 (1997-11-01), None
patent: 1 126 370 (1968-09-01), None
patent: 10051136 (1998-02-01), None
patent: 1202794 (1998-12-01), None
patent: 11087912 (1999-03-01), None
patent: 11087932 (1999-03-01), None
patent: 11251365 (1999-09-01), None

Affiliated with

Also associated with

Rating

Manufacturing method for wiring circuit substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method for wiring circuit substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for wiring circuit substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3703200