Etching a substrate: processes – Gas phase etching of substrate
Reexamination Certificate
2011-03-08
2011-03-08
Norton, Nadine G (Department: 1713)
Etching a substrate: processes
Gas phase etching of substrate
Reexamination Certificate
active
07901587
ABSTRACT:
After an external shape of a photoresist layer is patterned with use of a Cr film as an underlayer, i.e., a metal film to serve as an anticorrosive film that resists crystal etching, and an Au film as a surface layer, the Au film is etched. After groove portions are then patterned, the Cr film is etched. Since no degenerated-surface layer cannot be formed on the photoresist layer with an etchant for the Au film, the groove portions can be patterned without any degenerated-surface layer according to this method, so that high-accuracy groove portions can be formed.
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Ikeda Tomoo
Yamamoto Izumi
Citizen Holdings Co. Ltd.
Duclair Stephanie
Norton Nadine G
Smith , Gambrell & Russell, LLP
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