Manufacturing method for semiconductor integrated circuit,...

Details Manufacturing method for semiconductor integrated circuit,... Manufacturing method for semiconductor integrated circuit,...

2007-01-23

2007-01-23

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S690000

Reexamination Certificate

active

10996857

ABSTRACT:
A semiconductor integrated circuit is so structured that a first insulating layer is formed on a surface of a semiconductor chip and a second insulating layer covers an entire region of the surface of the semiconductor chip. Via apertures made to the second insulating layer, an electrical connection configuration is formed from above the second insulating layer by using gold wires. Then, an electronic component is mounted on the second insulating layer. By arranging as such, the electronic component is mounted on the semiconductor chip in advance. Therefore, it is possible to further reduce mounting space on a printed-wiring board and also possible to make is easy to attain one-packaged IC.

REFERENCES:
patent: 2005/0224962 (2005-10-01), Akamatsu et al.
patent: 2002-246535 (2002-08-01), None

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