Manufacturing method for semiconductor devices, and...

Details Manufacturing method for semiconductor devices, and... Manufacturing method for semiconductor devices, and...

2005-08-01

2009-12-08

Tran, Minh-Loan T (Department: 2895)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S014000, C438S017000, C438S462000, C438S463000

Reexamination Certificate

active

07629228

ABSTRACT:
On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device among the respective semiconductor devices is partially exposed, and then plasma etching is applied to the mask placement-side surface of the semiconductor wafer so as to dice the semiconductor wafer into the respective semiconductor devices along the defined dicing lines, and an exposed portion of the flawed semiconductor device is removed so as to form a removed portion as a flawed semiconductor device distinguishing mark.

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