Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-05-10
2011-05-10
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C438S613000, C438S614000, C438S665000, C438S906000, C257SE21507
Reexamination Certificate
active
07939373
ABSTRACT:
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.
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Chinese Office action dated Aug. 21, 2009 mailed in CN Appln No. 2008101455117.
Mizuhara Hideki
Nakamura Takeshi
Usui Ryosuke
Fish & Richardson P.C.
Fourson George
Sanyo Electric Co,. Ltd.
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