Manufacturing method for semiconductor device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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Details

C438S698000

Reexamination Certificate

active

07816160

ABSTRACT:
The present invention includes forming an optical guide layer on a substrate, forming a cap layer on the optical guide layer, and forming openings in parts of the optical guide layer and the cap layer to form a diffraction grating from part of the optical guide layer. The substrate is heated to a temperature less than a growth temperature of the cap layer and equal to at least a temperature at which mass transport of the cap layer occurs to cover, with part of the cap layer, the lateral faces of the optical guide layer exposed by the openings. A burying layer burying the diffraction grating is formed on the substrate, after the mass transport.

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patent: 6107112 (2000-08-01), Kito et al.
patent: 6625189 (2003-09-01), Kito et al.
patent: 2003/0156604 (2003-08-01), Yamazaki
patent: 08-274406 (1996-10-01), None
patent: 2000-261104 (2000-09-01), None
patent: 2001-168455 (2001-06-01), None
patent: 2003-243767 (2003-08-01), None
patent: 2004-055881 (2004-02-01), None
patent: 2006-049714 (2006-02-01), None

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