Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2008-08-29
2010-10-19
Smith, Matthew S (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S698000
Reexamination Certificate
active
07816160
ABSTRACT:
The present invention includes forming an optical guide layer on a substrate, forming a cap layer on the optical guide layer, and forming openings in parts of the optical guide layer and the cap layer to form a diffraction grating from part of the optical guide layer. The substrate is heated to a temperature less than a growth temperature of the cap layer and equal to at least a temperature at which mass transport of the cap layer occurs to cover, with part of the cap layer, the lateral faces of the optical guide layer exposed by the openings. A burying layer burying the diffraction grating is formed on the substrate, after the mass transport.
REFERENCES:
patent: 5023198 (1991-06-01), Strege
patent: 6107112 (2000-08-01), Kito et al.
patent: 6625189 (2003-09-01), Kito et al.
patent: 2003/0156604 (2003-08-01), Yamazaki
patent: 08-274406 (1996-10-01), None
patent: 2000-261104 (2000-09-01), None
patent: 2001-168455 (2001-06-01), None
patent: 2003-243767 (2003-08-01), None
patent: 2004-055881 (2004-02-01), None
patent: 2006-049714 (2006-02-01), None
Nagira Takashi
Watatani Chikara
Leydig , Voit & Mayer, Ltd.
Mitsubishi Electric Corporation
Parker John M
Smith Matthew S
LandOfFree
Manufacturing method for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method for semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4156030