Manufacturing method for semiconductor device

Details Manufacturing method for semiconductor device Manufacturing method for semiconductor device

1991-09-13

1992-11-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437215, 437217, 257668, H01L 2160

Patent

active

051660997

ABSTRACT:
A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.

REFERENCES:
patent: 4250347 (1981-02-01), Fierkens
patent: 5041395 (1991-08-01), Steffen
patent: 5057461 (1991-10-01), Fritz
patent: 5064706 (1991-11-01), Ueda

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