Manufacturing method for sealing a semiconductor device

Details Manufacturing method for sealing a semiconductor device Manufacturing method for sealing a semiconductor device

2005-07-19

2005-07-19

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S026000, C438S118000, C438S121000

Reexamination Certificate

active

06919218

ABSTRACT:
A manufacturing method of a semiconductor device that is sealed by bonding a sealing member to a substrate mounting a semiconductor element thereon includes the steps of: forming an opening in the sealing member; and closing the opening after the sealing member is bonded to the substrate.

REFERENCES:
patent: 5059558 (1991-10-01), Tatsanakit et al.
patent: 5081327 (1992-01-01), Graham et al.
patent: 5302778 (1994-04-01), Maurinus
patent: 5880403 (1999-03-01), Czajkowski et al.
patent: 2002-185827 (2002-06-01), None

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